Ipc-7530 Apr 2026

: The stage where the temperature exceeds the solder's liquidus point to form the joint.

: Gradually increasing the temperature to avoid thermal shock to the PCB or components. IPC-7530

: Controlled cooling to determine the grain structure of the solder joint. Guidelines for Effective Profiling IPC-7530 Standard Only | electronics.org : The stage where the temperature exceeds the

: Usually 20°C to 40°C above the solder's melting point. IPC-7530

: The duration the solder remains in a liquid state.